Our strategic partners for PCB Fabrication and Assembly have been continuously qualified by our experienced designers and well-trained management team.
We are currently engaged in strategic partnerships that support both rapid turn around times and complex design and layout services. These partners ensure that critical manufacturing and test requirements are designed into every product that we build.
LAYER COUNT: 2-20 Layer
Maximum Board thickness: 0.200″
LINE WIDTH: 0.003″ (0.075 mm)
CONVENTIONAL DRILL SIZE: 0.0098″(0.25 mm)
BSURFACE: HAL , Ni/Au, Preflux
IMPEDANCE: +/- 5%
BURIED/BLIND VIA
HEAVY COPPER: 60Z (inner/out layer)
CHDI: 1+N+1, 2+N+2, 3+N+3,
1+3+3+1, 1+4+4+1, Stack Vias.
BOARD THICKNESS: 0.0065″ ~ 0.180″
HASL, Reflow, Entek, Immersion gold, Electroless Gold, Deep Electrolytic Gold, Immersion Tin, Electroless Palladium
FR402, FR406, FR408 (High Tg), Polyamide